Wafers
Our exclusive Precision Abrasive Machining (PAM) process allows us to resolve up to 100 micron features while imparting low stress and minimizing compromises to the substrate. We are able to use micro blasting to create detailed features and shapes, such as holes, squares, channels, slots, mesa pads, blind vias and more.
Industries Served
- MEMS / Sensors
- Semiconductor
- Aerospace
- Biomedical
- Structural Ceramics
Potential Applications
- Wafer Level Packaging
- Pressure Sensors
- Accoustics
- Bio-MEMS (Lab-On-Chip)
- Microfluidics
Materials
- Glass, Silicon, Sapphire Wafers
- Ceramics (Alumina thru Zirconia
- Quartz
- Composites
Contact Us
For more information contact Wes Barton, Senior Application & Sales Specialist at (218) 624-6451 or wbarton@ikonics.com
