Our exclusive Precision Abrasive Machining (PAM) process allows us to resolve up to 100 micron features while imparting low stress and minimizing compromises to the substrate. We are able to use micro blasting to create detailed features and shapes, such as holes, squares, channels, slots, mesa pads, blind vias and more.
- MEMS / Sensors
- Structural Ceramics
- Wafer Level Packaging
- Pressure Sensors
- Bio-MEMS (Lab-On-Chip)
- Glass, Silicon, Sapphire Wafers
- Ceramics (Alumina thru Zirconia